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MPX12 rev 8, 09/2008 freescale semiconductor ? freescale semiconductor, inc. , 2007-2008. all rights reserved. pressure + 10 kpa uncompensated silicon pressure sensors the MPX12 series silicon piezoresisti ve pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. this standard, low cost , uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. compensation techniques are simplified because of the predicta bility of freescale's single element strain gauge design. features ? low cost ? patented silicon shear stress strain gauge design ? ratiometric to supply voltage ? easy to use chip carrier package options ? gauge options ? durable epoxy package ordering information device name package options case no. # of ports pressure type none single dual gauge differential absolute MPX12d tray 344 ? ? MPX12dp tray 344c ? ? MPX12gp tray 344b ? ? mpxv12gw6u rail 1735 ? ? mpxv12gw7u rail 1560 ? ? MPX12 0 to 10 kpa (0 to 1.45 psi) 55 mv full scale span (typical) series small outline package mpxv12gw7u case 1560-02 mpxv12gw6u case 1735-01 MPX12gp case 344b-01 MPX12d case 344-15 MPX12dp case 344c-01 unibody packages application examples ? air movement control ? environmental control systems ? level indicators ? leak detection ? medical instrumentation ? industrial controls ? pneumatic control systems ? robotics
MPX12 sensors 2 freescale semiconductor pressure operating characteristics table 1. operating characteristics (v s = 3.0 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit differential pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0? 10 kpa supply voltage (2) 2. device is ratiometric within this specified excitation r ange. operating the device above the specified excitation range may i nduce additional error due to device self-heating. v s ?3.0 6.0 vdc supply current i o ?6.0 ? madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output volt age at full rated pressure and the output voltage at the minimum related pressure. v fss 45 55 70 mv offset (4) 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 020 35 mv sensitivity v/ p?5.5 ?mv/kpa linearity ? ?0.5 ? 5.0 %v fss pressure hysteresis (6) (0 to 10 kpa) ? ? 0.1 ? %v fss temperature hysteresis (?40 c to +125 c) ? ? 0.5 ? %v fss temperature coefficient of full scale span tcv fss ?0.22 ? ?0.16 %v fss / c temperature coefficient of offset tcv off ? 15 ? v/ c temperature coefficient of resistance tcr 0.21 ? 0.27 %z in / c input impedance z in 400 ? 550 output impedance z out 750 ? 1250 response time (5) (10% to 90%) 5. response time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. t r ?1.0 ? ms warm-up time (6) 6. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure is stabi lized. ??20? ms offset stability (7) 7. offset stability is the product?s output deviation when subjected to 1000 hours of pu lsed pressure, temper ature cycling with bias test. ? ? 0.5 ? %v fss
MPX12 sensors freescale semiconductor 3 pressure maximum ratings figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. uncompensated pressure sensor schematic voltage output versus appl ied differential pressure the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacu um side (p2). similarly, output voltage increases as increasing vacuum is applied to the vacuum side (p2) relative to the pressure side (p1). table 2. maximum ratings (1) 1. exposure beyond the specified limits may caus e permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 75 kpa burst pressure (p1 > p2) p burst 100 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c 1 2 3 4 gnd +v out ?v out +v s sensing element
MPX12 sensors 4 freescale semiconductor pressure temperature compensation figure 2 shows the typical output characteristics of the MPX12 series over temperature. because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. however, the properties of the strain gauge itself are temper ature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. temperature compensation and offset calibration can be achieved rather simply with addi tional resistive components, or by designing your system using the mpx2010d series sensor. several approaches to external temperature compensation over both ?40 to +125 c and 0 to +80 c ranges are presented in applications note an840. linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range ( figure 3 ). there are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (l ower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. freescale?s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. output vs. pressure differential figure 3. linearity specification comparison pressure differential output (mvdc) 80 70 60 50 40 30 20 10 0 0 0.3 2.0 0.6 4.0 0.9 6.0 1.2 8.0 10 1.5 psi kpa span range (typ) offset (typ) v s = 3 v dc p1 > p2 -40 c +25 c +125 c linearity actual theoretical offset (v off ) max p op output (mvdc) pressure (kpa) 70 60 50 40 30 20 10 0 0 span (v fss ) 80
MPX12 sensors freescale semiconductor 5 pressure figure 4. cross-sectional diagram (not to scale) figure 4 illustrates the differential/gauge die. a gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. media other than dry clean air may have adverse effects on sensor performance and long term reliability. contact the factory for information regarding media compatibility in your application. pressure (p1)/vacuum (p2) side identification table freescale designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing gel which isolates the die from the environment. the freescale mpvz12 series is designed to operate with pos itive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the following table gel die coat wire bond die p1 stainless steel cap thermoplastic case die bond differential sensing element p2 lead frame part number case type pressure (p1) side identifier mpxv12gw6u 1735 side with port mpxv12gw7u 1560 side with port MPX12d 344 stainless steel cap MPX12dp 344c side with part marking MPX12gp 344b side with port attached
MPX12 sensors 6 freescale semiconductor pressure package dimensions case 1735-01 issue a small outline package
MPX12 sensors freescale semiconductor 7 pressure package dimensions case 1735-01 issue a small outline package
MPX12 sensors 8 freescale semiconductor pressure package dimensions case 1735-01 issue a small outline package
MPX12 sensors freescale semiconductor 9 pressure package dimensions case 1560-02 issue c small outline package
MPX12 sensors 10 freescale semiconductor pressure package dimensions case 1560-02 issue c small outline package
MPX12 sensors freescale semiconductor 11 pressure package dimensions case 1560-02 issue c small outline package
MPX12 sensors 12 freescale semiconductor pressure package dimensions case 344-15 issue aa unibody package case 344b-01 issue b unibody package notes: 1. 2. 3. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). m a m 0.136 (0.005) t 1234 pin 1 r n l g f d 4 pl seating plane -t- c m j b -a- dambar trim zone: f this is included within dim. "f" 8 pl 1 23 4 y z style 1: pin 1. ground 2. + output 3. + supply 4. - output style 2: pin 1. v cc 2. - supply 3. + supply 4. ground style 3: pin 1. gnd 2. -vout 3. vs 4. +vout dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30? nom 30? nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 y 0.048 0.052 1.22 1.32 z 0.106 0.118 2.68 3.00 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. d 4 pl f u h l port #1 positive pressure (p1) pin 1 -a- -q- s k g -p- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 seating plane b n r c j -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10
MPX12 sensors freescale semiconductor 13 pressure package dimensions case 344c-01 issue b unibody package notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. port #2 port #1 port #2 vacuum (p2) (p1) seating plane seating plane k s w h l u f g d 4 pl port #1 positive pressure -q- 12 4 3 pin 1 -p- -t- -t- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t b n j c v r -a- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.248 0.278 6.30 7.06 w 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10
MPX12 rev. 8 09/2008 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor china ltd. exchange building 23f no. 118 jianguo road chaoyang district beijing 100022 china +86 010 5879 8000 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or +1-303-675-2140 fax: +1-303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2008. all rights reserved.

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